A TEM Observation of Solder Joints of an Electronic Device
نویسندگان
چکیده
منابع مشابه
Gold Embrittlement of Solder Joints
Gold embrittlement of solder joints has been written about for at least four decades [1 – 3]. Nevertheless, gold embrittlement related solder joint failures have been analyzed in this laboratory as recently as July 2009. Gold embrittlement can be avoided by careful solder joint design and knowledge of the causes of this condition. The purpose of this paper is to provide a detailed account of ma...
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Introduction Intermetallic compounds (IMCs) are generally considered a bad thing in solder joints, though this is not always the case. Excessive IMCs in solder joints are a bad thing since they significantly alter both the composition and the mechanical performance of the solder joint. Interfacial IMC layers can be an indication of the quality of the solder joint and the lack of them would indi...
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15 صفحه اولFatigue damage in solder joints
Miniaturisation of electronic products is increasingly important for reasons of functionality enhancement and freedom of design. This is realised by integration into silicon and developing miniature packages with high I/O and power dissipation density. Generally this leads to elevated temperatures, not only in the components but also in the solder joints. Elevated temperature cycling leads to f...
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ژورنال
عنوان ژورنال: Journal of the Japan Institute of Metals and Materials
سال: 2000
ISSN: 0021-4876,1880-6880
DOI: 10.2320/jinstmet1952.64.3_213